The FPGA solder joint height inspection solution achieves efficient, precise, and non-contact measurement through the innovative application of line laser profile scanning technology....
Inspection requirements: 1. Height from pin to ring; 2. Height from triangular step to ring; 3. Height from ring to plastic surface; 4. Ring radius; 5. Deviation distance between pin and ring center....
Using the POMEAS IMAGE3 PRO-H image dimensioning system with its modular measurement setup, place the frame on the measurement platform. With just one click, you can quickly measure the product’s r......
The POMEAS IMAGE3 PRO series of flash measurement instruments allows you to place the product on the measurement platform, use stitching measurement, and obtain dimensions with a single click, with......
Using a 4K camera paired with a 1x tube, a 12.5x ZOOM LENS, and a 10x APO objective lens, the system enables high-definition pollen detection, ensuring that every pixel is effectively utilized....
Place the bearing on the Telecentric Measurement System platform, edit the program to measure the corresponding dimensions, click “Acquire,” and the inspection is complete. The dimensional results ......
By utilising the non-perspective nature of telecentric optics, combined with the synergistic effects of high-resolution imaging and a parallel light source, consistency deviations in batch measurem......
The image dimension measuring instrument meets the high-precision measurement demands of smartphone mid-frame molds by relying on two core technological foundations: a high-precision visual acquisi......