Are ZOOM LENSes suitable for semiconductor inspection solutions?
Semiconductor inspection involves both wide-area initial inspection and micron-level microscopic re-inspection; fixed-focus lenses can only provide a fixed field of view, and frequent lens changes ......
A New Solution for Deep-Hole Inspection: White-Light Interferometric Profiler
When used in conjunction with a dedicated deep-hole attachment, the white-light interferometric profilometer is capable of accurately reproducing the three-dimensional topography of the inner wall ......
Ultra-precision surface quality inspection equipment – white-light interferometric 3D profilometer
In the field of ultra-precision manufacturing, white-light interferometric 3D profilometers have become the preferred choice for surface quality inspection equipment, thanks to their nanometre-leve......
What is the main difference between a telecentric ZOOM LENS and a conventional ZOOM LENS?
The difference between telecentric ZOOM LENSES and conventional ZOOM LENSES is that telecentric ZOOM LENSES offer greater precision and are not affected by changes in working distance....
What is a telecentric ZOOM LENS?
A telecentric ZOOM LENS is a specially designed optical lens in which the optical axis remains parallel across the entire field of view; it is suitable for applications such as high-precision measu......
What should you look out for when choosing a manufacturer of semiconductor inspection lenses?
When selecting a manufacturer of semiconductor inspection lenses, it is important to consider the quality of their products, their technical expertise, after-sales service and reputation within the......
What are the main types of lenses used in die-bonding machines?
The lenses used in die-bonding machines mainly include optical microscope lenses, CCD camera lenses and infrared lenses, which are used in different die-bonding applications....
How do I choose the right model of double-telecentric lens?
When selecting a suitable dual-telecentric lens model, the key considerations must be based on the core requirements of the specific application scenario, namely dimensional measurement accuracy, f......
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