In the field of industrial manufacturing, precise inspection is a critical step in ensuring product quality. For example, in semiconductor packaging processes, a deviation of just 0.01 mm in adhesive height can cause electrical connections between the chip and the substrate to fail. Traditional methods for adhesive height inspection of PIE samples often suffer from issues such as low efficiency and insufficient accuracy. However, POMEAS’s proprietary 3D line laser profilometer, with its exceptional performance and innovative technology, offers a completely new solution for adhesive height inspection.
Challenges of Traditional Testing
In the past, when measuring the adhesive height of PIE samples, manual inspection was not only slow but also prone to subjective factors, resulting in significant errors in the test results. Some inspection devices based on traditional optical principles also struggle to accurately capture the true adhesive height data when dealing with PIE samples of complex shapes, failing to meet the demands of modern industrial production for high precision and efficiency.
Solution

POMEAS’ proprietary 3D line laser profilometer employs advanced laser scanning technology to quickly and accurately capture the three-dimensional contour data of objects. In adhesive height measurement, the sensor is mounted above the PIE sample. As the PIE sample moves horizontally, the sensor scans the sample surface in real time, generating a high-precision point cloud. Through specialized algorithmic processing, the adhesive height data is precisely extracted from the point cloud, achieving measurement accuracy at the micrometer level and significantly enhancing the accuracy of the inspection.
Testing Process

During the inspection process, the product is first precisely positioned using a metal area as a template. This step ensures consistent positioning for each inspection, providing a reliable foundation for subsequent adhesive height calculations. Next, an area adjacent to the adhesive ring is selected as a reference point. By calculating the height of the adhesive relative to this reference point, an accurate adhesive height value is obtained. Even if the adhesive surface is uneven or partially missing, the sensor’s powerful data processing capabilities enable it to provide inspection results with the highest possible accuracy, minimizing the impact of surface irregularities on the inspection process.
Intuitive Display of Detection Data


Inspection data collected by 3D line laser profilometers can be presented in the form of intuitive charts and images. Operators can clearly see the distribution of adhesive height and identify any anomalies, enabling them to promptly adjust and optimize the production process. This intuitive data visualization not only improves work efficiency but also provides a solid basis for quality control.
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