Line laser profile sensors have become a key technology in the field of industrial automation thanks to their high-precision 3D shape reconstruction capabilities and millisecond-level detection speeds.
Replacing contact measurement, it achieves full inspection of production lines and captures minute height differences that cannot be detected by traditional vision systems through sub-micron Z-axis resolution.
① Battery tab thickness monitoring
Real-time detection of the thickness uniformity of lithium battery tabs (positive and negative electrodes) to meet ±1μm accuracy requirements, ensuring battery safety and consistent charging and discharging performance.
② PCB component height measurement
When scanning the installation height of surface-mounted components (capacitors/chips/shielding covers) on PCBA, it can achieve an accuracy of ±1μm, avoiding false soldering or assembly interference caused by component tilt.
Generate cross-sectional contour curves based on 3D point cloud data, quantify defect characteristics, and achieve zero missed inspections.
① Weld quality assessment
Can detect weld pit depth, undercut, and collapse, and automatically determine defect grade.
② Battery cell casing defect detection
Identify shell scratches (depth/width), dents, and foreign object protrusions, and use AI classification algorithms to distinguish between fatal defects and acceptable flaws.
Solving the “gripping-assembly” challenge for micron-level components
① Micro-device positioning guidance
Real-time 3D point cloud reconstruction of micro-components such as SIM card trays and FPC connectors, outputting 3D coordinates and attitude angles of pins (positioning accuracy: ±5μm)
② Adaptive assembly compensation
Guide the robot to dynamically correct the gripping path (e.g., offset/tilt compensation) Applications include smartphone motor assembly, semiconductor chip handling, and more.
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