In the precision manufacturing field of semiconductor packaging, accurate detection of the diameter of the solder balls is crucial. The smallest deviation in the diameter of the solder ball may affect the performance and reliability of the entire semiconductor device. POMEAS has developed a dual telecentric lens, which has successfully improved the accuracy of tin ball diameter detection to 1μm, bringing a new technological breakthrough to the semiconductor packaging industry.

The double telecentric lens has unique optical characteristics. Its object-side telecentric optical path and image-side telecentric optical path effectively eliminate measurement errors caused by changes in object distance, ensuring stable acquisition of high-precision images at different working distances. This feature enables the dual telecentric lens to maintain excellent performance in complex semiconductor packaging production environments.

In semiconductor packaging, tin ball as a key component connecting the chip and the substrate, the precise control of its diameter is directly related to the quality of the electrical connection of the chip and the efficiency of signal transmission. Traditional inspection methods have certain limitations in terms of accuracy, making it difficult to meet the growing demand for high-precision inspection. POMEAS' dual telecentric lenses, with their excellent optical performance, can clearly capture the subtle contours of the solder balls, and through advanced image algorithms and processing technology, realize high-precision measurement of the diameter of the solder balls.

The increased detection accuracy of 1μm means that during the semiconductor packaging process, tin balls that meet the standards can be screened more accurately, reducing the rate of product defects due to deviations in the diameter of the balls. This not only helps to improve the overall quality of semiconductor devices, but also effectively reduces production costs and improves production efficiency.