In the booming semiconductor industry, wafers as the basic core components of chip manufacturing, the precise control of its package thickness is crucial. The thickness of the wafer package is directly related to the electrical performance of the chip, heat dissipation efficiency, and the reliability and stability of the final product. The slightest thickness deviation may cause signal transmission delay, heat dissipation obstruction and other thorny issues, which in turn affects the performance of the entire semiconductor device, so the measurement accuracy has almost demanding requirements.

Challenges in Wafer Package Thickness Measurement

1、The surface of the wafer is made of various materials, complex structure, both semiconductor substrate and encapsulation layer of different materials, conventional contact measurement is easy to scratch the fragile surface of the wafer, resulting in product damage;

2、Wafer in the production flow, positioning and placement process inevitably exists to a certain degree of tilt, offset, ordinary measurement methods are very easy to introduce significant measurement errors due to these attitude changes, resulting in data inaccuracy, it is difficult to meet the large-scale industrialized production of high-precision, high-stability on-line measurement of the urgent needs.

Wafer Package Thickness Measurement Solution

POMEAS spectral confocal sensors in wafer packaging thickness measurement applications in the production chain, to ensure stable online measurement, to avoid frequent downtime calibration, retesting, reduce production interruption time, improve overall production capacity; in the quality control level, high-precision data for process optimization, defect detection to provide support, to help companies adjust the packaging process parameters in a timely manner, to reduce the output of defective products.