Spectral confocal sensors have a wide range of applications in semiconductor wafer fabrication, thanks to their high accuracy, high stability and broad applicability. The following is a specific introduction to spectral confocal sensors for semiconductor wafer applications:

Measurement of key wafer parameters: The spectral confocal sensor is capable of non-contact measurement of key parameters such as dimensional deviation, surface roughness and flatness of wafers. Its high-precision measurement capability ensures that the dimensional deviation of the wafer is less than 0.002mm/m, and the deviation between the surface roughness and the centerline of the wafer is less than 0.01~0.02um, which meets the high-precision requirements of wafer manufacturing.

Ensure wafer thickness uniformity: The uniformity of wafer thickness is critical to chip performance. Spectral confocal sensors can accurately measure wafers at different positions and depths to ensure wafer thickness uniformity. With real-time feedback of measurement data, production staff can adjust process parameters in a timely manner to improve chip performance and reliability.

Detection of wafer surface defects: Small defects on the wafer surface, such as scratches and cracks, can affect the performance and reliability of the chip. Spectral confocal sensor can generate high-resolution three-dimensional image, and through spectral analysis technology to identify the wafer surface of the small defects. This non-destructive testing method not only improves testing efficiency, but also avoids the damage and contamination that may be caused by traditional contact measurement.

Monitoring of polishing quality: Wafer polishing is one of the important parts of the semiconductor manufacturing process. The quality of the polished wafer surface directly affects the smoothness of the subsequent process steps and the final performance of the chip. Spectral confocal sensors can monitor the thickness and flatness of the polished wafer surface in real time to ensure that the polishing quality meets the process requirements. At the same time, its non-contact measurement avoids the secondary pollution and damage that may be caused by traditional contact measurement.

Measurement of Bump 3D morphology: In advanced packaging processes, the 3D morphology of the bump on the wafer is critical to the quality of the package. Spectral confocal sensors enable accurate measurement of bump height, diameter and coplanarity, providing accurate data support for the packaging process. Through real-time feedback of the measurement data, production personnel can adjust the packaging process parameters in a timely manner to ensure that the quality of the package meets the design requirements.

Spectral confocal sensors also have technical advantages such as nanometer-level precision measurement, omni-directional measurement, ultra-small spot, and ultra-high sampling rate, which makes them more accurate and more widely used in semiconductor wafer fabrication.