Laser contour sensor is a high-precision, high-speed 3D measurement technology that has been widely used in industrial automation, robot navigation, machine vision and other fields.

With the continuous development of industry, hardware moulds are more and more widely used in various fields. Hardware mould is an indispensable part of the manufacturing process, and its precision and quality directly affect the product yield and appearance quality. Measuring the angle of hardware mould is one of the important means to ensure the precision and quality of mould processing.

The traditional method of measuring the angle of hardware mould is mainly to use calipers, angle rulers and other manual measuring tools, this method is simple and easy to use, but there are problems such as cumbersome operation and low measurement accuracy. The laser contour sensor is a new type of measuring tool, which adopts the principle of laser triangular reflection, can quickly and accurately measure the angle of hardware mould, and has many advantages.

The laser contour sensor is non-contact measurement, which does not require direct contact with the product, thus avoiding the errors that may be brought by mechanical measuring instruments. Secondly, the laser contour sensor has high measurement accuracy and repeatability, which enables it to quickly and accurately measure the angle of hardware moulds and to complete a large number of measurement tasks in a short period of time, thus improving the measurement efficiency.

The laser profile sensor can also achieve automated measurement, through the linkage with the computer system to achieve a series of work such as data acquisition, processing, analysis, etc., which improves the measurement accuracy and efficiency.

In conclusion, the application of laser profile sensor in the angle measurement of hardware mould has irreplaceable advantages. It can achieve fast, accurate, safe and automated measurement, improve the efficiency and quality of work, and make important contributions to the development of related fields.